Hands-On Training on Power Electronic Hardware Implementation and Testing
July 30 - August 2
Event: Hands-On Training on Power Electronic Hardware Implementation and Testing
Date & Time: July 30, 2026 – August 02, 2026
Venue: Department of Electrical Engineering, IIScAbstract:The objective of this workshop is to provide participants with practical knowledge and hands-on
experience in the development of power electronic converters. The focus is on the complete
hardware development workflow, from component selection and simulation-assisted verification
to PCB design, construction, testing, troubleshooting, and performance evaluation. Unlike
traditional power electronics courses that focus primarily on converter analysis and design theory,
this workshop concentrates on the practical aspects of hardware realization. There will be very few
lecture sessions and most of the time will be spent in hands-on simulation, building and testing of
power converter in the lab. The workshop is intended for students, researchers, and practicing
engineers who wish to strengthen their experimental and hardware-oriented skills in power
electronics.
experience in the development of power electronic converters. The focus is on the complete
hardware development workflow, from component selection and simulation-assisted verification
to PCB design, construction, testing, troubleshooting, and performance evaluation. Unlike
traditional power electronics courses that focus primarily on converter analysis and design theory,
this workshop concentrates on the practical aspects of hardware realization. There will be very few
lecture sessions and most of the time will be spent in hands-on simulation, building and testing of
power converter in the lab. The workshop is intended for students, researchers, and practicing
engineers who wish to strengthen their experimental and hardware-oriented skills in power
electronics.
Course content
Module 1: Power semiconductors
• Introduction to semiconductor devices
• Listing of semiconductor devices with necessary attributes.
• Double pulse test simulation in LTSPICE.
• Loss estimation and determination of switching frequency.
• Gate driver selection and corresponding circuit design
• Power circuit schematic design and BOM generation.
• Power circuit PCB layout
• Parasitic extraction from the PCB layout
• Gate circuit optimisation through DPT simulation.
• Introduction to semiconductor devices
• Listing of semiconductor devices with necessary attributes.
• Double pulse test simulation in LTSPICE.
• Loss estimation and determination of switching frequency.
• Gate driver selection and corresponding circuit design
• Power circuit schematic design and BOM generation.
• Power circuit PCB layout
• Parasitic extraction from the PCB layout
• Gate circuit optimisation through DPT simulation.
Module 2: High-frequency magnetics and capacitors
• Introduction to magnetic components (inductors, transformers)
• Selection of core material and geometry
• Selection of winding types (planar, foil, Litz)
• Insulation design and types of bobbins
• Simulation in a FEA tool and estimation of losses
• Hands-on winding of E-core and Toroid transformer
• A practical guide to capacitor selection
• Introduction to magnetic components (inductors, transformers)
• Selection of core material and geometry
• Selection of winding types (planar, foil, Litz)
• Insulation design and types of bobbins
• Simulation in a FEA tool and estimation of losses
• Hands-on winding of E-core and Toroid transformer
• A practical guide to capacitor selection
Module 3: Thermal management
• Thermal design considerations for power electronic converters
• Selection of heat sinks and cooling strategies
• Air-cooled thermal analysis using finite-element simulation
• Liquid-cooled thermal analysis using finite-element simulation
• Thermal modelling of magnetic components
• Practical approaches to thermal characterization and validation
• Thermal design considerations for power electronic converters
• Selection of heat sinks and cooling strategies
• Air-cooled thermal analysis using finite-element simulation
• Liquid-cooled thermal analysis using finite-element simulation
• Thermal modelling of magnetic components
• Practical approaches to thermal characterization and validation
Module 4: Test and Measurement
• Double pulse test.
• Measurement and characterisation of passive components.
• Efficiency measurement.
• EMC measurement.
• Thermal measurement.
• Debugging and troubleshooting.
• Double pulse test.
• Measurement and characterisation of passive components.
• Efficiency measurement.
• EMC measurement.
• Thermal measurement.
• Debugging and troubleshooting.
Outcome: Gain comprehensive hands-on experience in the implementation, fabrication, testing,
characterization, and validation of power electronic converter hardware.
characterization, and validation of power electronic converter hardware.