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EE Seminar: High voltage aviation electrical system EMC challenges and opportunities
April 24 @ 4:00 PM - 6:00 PM IST
I cordially invite you to attend this talk by Dr. Cong Li from GE Aerospace Research, Niskayuna, NY, USA. The details are given below.
Date & Time: 24/04/2023, 10.30 am – 11.30 am
Venue: MMCR, Dept. of Electrical Engineering (Hybrid Mode)
For online participants:Meeting Link
Title: High voltage aviation electrical system EMC challenges and opportunities
Abstract: High voltage aviation electrical systems have unique design challenges to meet ultrahigh power density and reliability requirements under extreme operation conditions. One critical aspect is the Electromagnetic Compatibility (EMC), such as emission and susceptibility, etc. This talk will explain the fundamental EMC challenges for wide band gap (WBG) based high voltage aviation electrical system, and share an effective “SOLVE” EMC design process for meeting stringent aviation EMC requirements.
Speaker Bio: Dr. Cong Li (S’09-M’15-SM’19) received the Ph.D. degree in electrical engineering specializing in power electronics from The Ohio State University, Columbus, OH, USA, in 2014. He joined GE Aerospace Research at Niskayuna, NY, USA as a Research Engineer in 2014 and is currently a Senior Power Electronics Engineer and EMC Lead. His research interests include aviation high voltage, high power, high density wide band gap (WBG) power electronics systems, and EMI mitigation techniques. He is currently leading multiple flight demo EMC projects at GE Research. He has authored more than dozens of technical papers, and patent applications in the area of power electronics and EMC. He is a voting member of commercial aviation DO-160 EMI standard working group.
He has been given EMI webinars and tutorials at multiple IEEE conferences such as ECCE, APEC, EMC Symposium, etc. He is currently a Senior Member of IEEE, and Associate Editor at IEEE Open Journal of Power Electronics. He is serving as secretary of IEEE-EMCS-SC5 Power Electronics EMC, as well as Technical Committee member of IEEE APEC, ECCE, ITEC, EATS conferences.