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DTSTART:20250101T000000
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DTSTART;TZID=Asia/Kolkata:20250128T150000
DTEND;TZID=Asia/Kolkata:20250128T170000
DTSTAMP:20260526T144941
CREATED:20250128T043207Z
LAST-MODIFIED:20250128T043207Z
UID:241890-1738076400-1738083600@ee.iisc.ac.in
SUMMARY:Talk on High-frequency Integrated Magnetics for High-performance Computing.
DESCRIPTION:Title: \nHigh-frequency Integrated Magnetics for High-performance Computing. \n  \nSpeaker: Ranajit Sai\, Tyndall National Lab \n  \nDate and Time: 28th January 2025\, Tuesday 3 pm \n  \nVenue: MMCR EE \n  \nAbstract: \nPower management for high performance processors\, SoCs and AI engines is evolving from Point of Load (POL) on-board DC-DC converters to in-package granular power delivery network (PDN). Granular PDN with integrated magnetics enables independently regulated per-core power delivery to match its power utilization profile within each workload\, thus reducing power overhead significantly and as a result enhancing system-level efficiency significantly. While the main role of the integrated inductor devices in a integrated voltage regulator remain same – to have sufficient inductance to filter the fundamental switching signal and have sufficient bandwidth to filter out the unwanted switching harmonics up to a certain frequency\, the form-factor and placement of these devices may vary significantly across applications. In addition\, these inductors must not saturate at the converter’s peak current\, while having lowest possible power loss over the entire operating range of the converter. Finally\, the magnetic component is expected to take as little space as possible – especially in the light of 3D integration\, height of the device is equally important to the footprint. The key question here is how to evaluate and compare integrated and embedded inductor devices for a certain voltage converter application. It is a daunting task even when the effect of temperature and electromagnetic interference (EMI) are not considered. \n  \nThis presentation will capture various efforts made by researchers over the past decade and the key technological trend of integrating high-frequency magnetic devices in 3D IC package. Furthermore\, key research and development scope in integrated magnetics will be highlighted.  \n  \nSpeaker’s bio: \nRanajit Sai is a Senior Researcher and Technical Lead of the Integrated Magnetics Research Group in Tyndall National Institute\, Ireland. He is driving design and development of futuristic on-silicon integrated thin-film magnetics and in-package embeddable magnetics for powering datacenter processors and AI engines. He’s leading research projects funded by leading industries\, research consortiums\, and Govt. agencies. His research is driven by probing novel physical phenomena\, tailoring material properties\, and solving technological bottlenecks through innovation in material development\, device design and integration strategies. \n  \nPrior to joining Tyndall in 2022\, Ranajit spent four years in Japan as an Asst. Professor at Tohoku University in Sendai\, and subsequently another four years in India as a Visiting Professor at Indian Institute of Science (IISc) in Bengaluru. He received his PhD in 2014 from Indian Institute of Science (IISc)\, India. To date\, Ranajit has published his work in 40+ journal/conference papers\, filed 5 patents\, and presented in more than 45 international conferences that include the flagship conferences organized by IEEE Magnetics Society\, IEEE Power Electronics Society\, and American Institute of Physics.              
URL:https://ee.iisc.ac.in/event/talk-on-high-frequency-integrated-magnetics-for-high-performance-computing/
LOCATION:MMCR\, Hall C 241\, 1st floor\, EE department
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