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DTSTAMP:20260528T035317
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SUMMARY:[Talk] Technology trends and innovation in HV transmission industry\,
DESCRIPTION:Talk \nTitle: Technology trends and innovation in HV transmission industry \nSpeaker: Dr. Manoj Pradhan\, Global R & D Manager HVDC\, Hitachi Energy\, Sweden \nDate: WEDNESDAY\, 29 November 2023 \nTime: 10:00-11:00 AM \nVenue: Seminar Hall\, HVE BUILDING \nCoffee will be served \nABSTRACT \nIn this presentation\, Dr. Pradhan\, R&D manager from Hitachi Energy will share technology trends in HV transmission industry and especially role of HVDC technology in enabling energy transition towards integration of renewable resources. He will provide a comprehensive view of how Hitachi Energy is playing a leading role in advancing the world’s energy system to be more sustainable\, flexible and secure. ​As the pioneering technology leader\, we collaborate with customers and partners to enable a sustainable energy future. \nBiography \n  \nManoj Pradhan joined ABB in 2008\, is now global R&D portfolio manager for HVDC at Hitachi Energy (formerly ABB)\, located in Sweden. He is responsible for technology\, product and solution readiness for both offshore and onshore HVDC projects. \nMr. Pradhan has represented Hitachi Energy in several international multiparty joint industrial initiatives (JIP). He is actively involved and leading discussions in several clean energy forum viz.\, European commission working group on offshore renewable\, EU Horizon InterOPERA and OceanGrid initiatives to enable EU’s renewable energy ambition. \nHe is a great promoter of sustainability and digitalization of power infrastructure. He has also led new business development projects in EV charging sector to align players in the ecosystem to make offerings to accelerate EV adoption. He has led cross business and customer engagement initiatives in decarbonization of steel industry. He has been board member of large research consortium on digitalization\, digital cellulose center. \nHe holds MSc. and PhD degrees in Electrical Sciences from Indian Institute of Science Bangalore\, India (2000-2004). He was senior researcher and postdoctoral research fellow at IIT Madras\, ETH Zurich\, Switzerland\, University of Queensland\, Australia. He is author of > 25 article in IEEE journals and international conferences and Inventor of > 25 granted patents and several high impact publications in CIGRE and IEEE. Mr. Pradhan holds management diploma from Wharton business school\, USA and diploma in global innovation management from Chalmers University of Technology\, Sweden. \nALL ARE WELCOME
URL:https://ee.iisc.ac.in/event/talk-technology-trends-and-innovation-in-hv-transmission-industry/
LOCATION:HV seminar Hall
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DTSTART;TZID=Asia/Kolkata:20231129T160000
DTEND;TZID=Asia/Kolkata:20231129T173000
DTSTAMP:20260528T035317
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SUMMARY:Talk: India Semiconductor Mission by Prof Tummala Rao
DESCRIPTION:Title: Next Gen\, Global- level and Large-scale Device\, Packaging and Systems R&D and Workforce development in India. \nSpeaker: Professor Tummala Rao is a distinguished IISc alumnus and an ISM\, India advisor. Former IBM Fellow and Founding Director of Georgia Tech 3D Systems Packaging Research Center. \nDate and Time: Wednesday\, November 29\, 2023. 4:00 PM \nVenue: MMCR Department of Electrical Engineering IISc \nTeams Link \nAbstract: India has not been a global player in semiconductors and packaging. But it can be with the new ISM initiative in manufacturing and R&D. Prof. Rao Tummala believes that India can transform its electronics by transforming its academics into industry-centric R&D culture\, based on the Georgia Tech model\, by performing massive global level R&D that India is capable of. But this R&D must be consistent with global industry needs in integrated systems packaging by highly- innovative\, young\, and energetic faculty and great executive Directors that India already has at its IITs and IISc. The proposal describes the strategic\, next- gen global level R&D\, education and skill development programs\, infrastructure needed for these and the resulting IP creation and exponential growth in startups to attract many global companies to make India globally competitive. Indian Government is committed to invest in next gen R&D at its academic institutions with the state-of-the-art facilities\, as well as state of the art facilities for technology development at ISRC thereby attracting companies both for R&D and manufacturing in both semiconductors and packages. With these investments\, India\, for the first time\, has all the programs necessary for it to be a global player in the short term and global leader in the long term in integrated systems. If such an investment by the GOI is matched by the industry in a consortium mode\, India can transform itself from its current design-centric to system centric with expertise and resources spanning from system design and architectures to system integration\, assembly and test to offer system foundry for the world. \nA proposal was developed by more than 50 academic faculty from India’s top 13 academic institution and 20  colleges and universities under the advice and leadership of Prof. Rao Tummala\, as a champion for vision\, strategy\, and programs\, based on a highly successful Georgia Tech model for leading-edge R&D from concept to commercialization\, education of large number cross-disciplinary students\, and industry partnership with about 100 global companies—all simultaneously. The Indian proposal is expected to result in 12 India-wide Centers of Excellence in 12 different strategic technologies funded by GOI and potentially another 12 COEs funded by the private industry. The proposal also involves partnership with more than 50 global semiconductor and packaging companies from around the globe and 24 global academic experts from Purdue\, Georgia Tech\, Penn State\, USC\, University of Arkansas\, Maryland\, Florida International and Illinois in the proposed 12 strategic research areas (SRAs). \nThe proposed R&D and workforce development programs are the best examples of how government\, universities and global companies can work together for mutual benefit. For the academic community\, the Indian universities will begin to perform global R&D and educate the needed workforce for the emerging semiconductor\, packaging\, and systems industry – the two most important strategic needs for the global industry. In so doing\, it will develop global academic faculty leaders and provide jobs for their students in India. For global academic collaborators from US\, Indian R&D provides additional opportunities\, in addition to educated students from India as their Ph. D students for the global industry\, India will develop most comprehensive\, large scale global- level R&D\, unlike most\, if not all countries\, and attract large number of companies to come to India\, just for R&D in a decade. For its investment\, Indian government can claim to have set up the complete ecosystem from research to technology development to manufacturing\, just like in advanced countries\, in semiconductors and packaging to grow its economy to capture a significant portion of $2T market\, to become 3rd largest economy by 2030. \n This program requires large number of faculty and students from electrical\, mechanical\, materials and chemical engineering disciplines \nBiography: Education: B.E: Indian Institute of Science. Ph.D.: U of Illinois \n\nIndustry: 25 years at IBM \n\n\n\nIBM Fellow and Director of Advanced Packaging Lab\nPioneered Industry 1st Plasma Display\nPioneered industry’s first LTCC for all RF applications.\nDeveloped Industry’s 1st 100-144 integrated chip package\, very much like today’s chip let package.\n\n\n\nAcademia: 28 Years at Georgia Tech as Distinguished & Chair Professor and Founding Director \n\n\n\n Founding Director of first and only   NSF Eng. Research Center in packaging in US pioneering System on Package vision\nCreated a model at Georgia Tech for a very large and successful global industry consortium.\nEducated 10\,000 engineers in more than 20 different packaging courses.\nGraduated 900 Ph. D & MS packaging engineers to supply to almost all electronic companies in US.\n\n\n\nProfessional Awards \n\n\n\nIEEE named him Father of Modern Packaging and created IEEE Rao Tummala Electronic Packaging Award\, a technical field award.\n Wrote > 800 papers\, 7 Textbooks and > 100 US patents.\nMember of National Academy of Eng.in US and India\, Fellow of IEEE\, &IMAPS\nPresident of IEEE CPMT 2000-2004 and President of IMAPS 1998-2000\n Distinguished Alumni of IISc\, U of Illinois and Distinguished faculty of Georgia Tech\n\n\n\nIndia; Now Advisor to Government of India and Championing large scale R&D and industry consortium in India. \n\nAll are welcome.
URL:https://ee.iisc.ac.in/event/talk-india-semiconductor-mission-by-prof-tummala-rao/
LOCATION:MMCR\, Hall C 241\, 1st floor\, EE department
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